2023 Project Leadership Award
Congratulations to the 5G/mmWave Materials Assessment and Characterization project team for receiving a 2023 INEMI Project Leadership Award. These awards recognize projects that have demonstrated superior performance of electronics manufacturing practices, provided solutions that enable significant technology and business results and/or had a positive impact on the electronics manufacturing value chain and its ecosystem. The project team members are:
Project Co-leaders:
- Say Phommakesone, Keysight Technologies
- Richard Stephenson, EMD Group
- Dr. Chang-Sheng Chen, ITRI
Participating Companies
- 3M
- ITRI
- AGC-Nelco
- Keysight
- AT&S
- MacDermid Alpha
- Centro Ricerche FIAT-FCA
- Mosaic
- Dell
- NIST
- EMD
- Nokia
- Flex
- Panasonic
- Georgia Tech
- QWED
- Hitachi Chemical (now Resonac)
- Sheldahl
- Ibiden
- Shengyi
- IBM
- Unimicron
- Intel
- Wistron
- Isola
- ZESTRON
- ITEQ
End-of-Project Webinar
Webinar presentation (includes link to recorded webinar)
Thursday, June 2, 2022
Project Reports
Report 1: Benchmark Current Industry Best Practices for Low Loss Measurements (November 2020)
Report 2: Benchmark Emerging Industry Best Practices for Low Loss Measurements (November 2020)
Report 3: A Round Robin Study to Determine Measurement Accuracies of Commercial Resonator-Based Techniques (January 2022)
Project Update
Download the latest update (December 22, 2021)
Statement of Work & Project Statement
Statement of Work (SOW) v1.0 (May 26, 2020)
Project Statement v1.0 (May 22, 2020)
Background
Next-generation 5G communications solutions require ultra-low loss laminate materials and PCBs/substrates for efficient design and manufacturing. However, these materials pose challenges. For example, there is no consistent methodology for measuring transmission loss or Df/Dk, especially for higher frequencies (e.g., >30 GHz). Many different approaches are currently used, requiring different fixtures and test methods, sample preparation, and/or data analysis/extraction.
Project Focus
The goal of this project is to develop a guideline/best practice for a standardized measurement and test methodology that can be shared with industry and relevant standards organizations. Initial focus will be to benchmark current available test methods and provide pro/con analysis, identify gaps (if any) for extending test methods to 5G/mmWave frequencies, as well as develop reliable reference standard materials for set-up and calibration.
The project will have two distinct phases:
- Phase 1: Develop technical guidelines and generate best practices for characterization of ultra-low loss laminate materials in the range of 5-100 GHz
- Phase 2: Extend the guidelines to PCB/substrate level characterization
INEMI Tech Topic Series 2021: 5G/mmWave
“Packaging for mmWave Communications,” Professor Madhavan Swaminathan (Georgia Institute of Technology), March 11, 2021
“Broad Dielectric Characterization of Polymers and Ceramics in the 5G Frequency Range,” Professor Michael Lanagan (Penn State), April 8, 2021
“Standard Reference Materials for 5G and Microwave Materials at NIST,” Dr. Nathan Orloff (NIST), May 6, 2021
“Enabling Thin Glass Solutions for 5G," Aric Shorey (Mosaic Microsystems), July 15, 2021
Presentations
Please note: several of the following presentations and/or papers are only available from the conference proceedings.
“Standardize Material Characterization to Enhance Future Communication and Sensing Application,” Chang-Sheng Chen, PhD, Industrial Technology Research Institute (ITRI), INEMI Session at IMPACT 2023, October 25, 2023; Taipei, Taiwan (available to members only)
Microwave Materials Keynote: “Recent Developments and Cross-Calibration of Resonator-Based Techniques for Microwave and mmWave Materials Assessment," Malgorzata Celuch and Marzena Olszewska-Placha (QWED), presented by Malgorzata Celuch, Microwave Materials and their Applications (MMA) conference, September 27, 2023; Mainz, Germany.
Microwave & Radar Week (MRW) 2022 (September 12-17; Gdansk, Poland) These presentations are available to INEMI members only; log-in required to download.
INEMI Workshop on Microwave and Millimetre-Wave Characterization of Dielectric Sheets: presentations by Dr. Marzena Olszewska-Placha (QWED, Bartlomiej Salski (Warsaw University of Technology) and Michael Hill, PhD (Intel)
Conference Keynote: “Correlating mmWave Permittivity Measurement Tools with an Introduction to Intel’s Metrology Capability Analysis,” Michael Hill, PhD (Intel)
INEMI 5G/mmWave Presentations at Device Packaging Conference (March 8; Fountain Hills, Arizona USA) (Please note: we do not have permission to post these presentations; please check with iMAPS for conference proceedings.)
Industry Challenges for Low Loss Measurements, Urmi Ray (INEMI) and Say Phommakesone (Keysight)
Key Highlights from INEMI 5G Project, Michael Hill (Intel)
5G Electronics: Bridging the Measurement Challenges, Magorzata Celuch and Marzena Olszewska-Placha (QWED)
mmWave Reference Material Development at NIST, Nathan Orloff (NIST)
The 5G/mmWave Materials Assessment and Characterization Project, Report 3: A Round Robin Study to Determine Measurement Accuracies of Commercial Resonator-Based Techniques (January 2022)
"Innovative Approaches to Solve Low Loss Materials Characterization Challenges," invited presentation, Urmi Ray (INEMI), Electronic Materials and Applications 2022, Session S13: 5G Materials and Applications Telecommunications — Metrology and Characterization of Materials, January 22, 2022, virtual event).
“5G/High Frequency Materials Characterization Challenges and Opportunities,” Urmi Ray (INEMI), Electronic Materials and Applications (EMA) Conference, American Ceramic Association (January 22, 2021; virtual event).
INEMI Session at IMPACT
December 21, 2021 (Taipei, Taiwan)
"Reliability & Loss Properties of Copper Foils for 5G Applications," Ed Kelley (Isola Group)
“Importance of Materials Characterization for 5G and Beyond,” Say Phommakesone (Keysight Technologies)
“5G/mmWave Material Characterization” Chang-Sheng Chen (ITRI)
“Measuring Complex Permittivity for 5G/mmWave Materials,” Hanna Kähäri (Nokia), Session 3.1: Equipment and Materials for Enabling High Performance, Connecting Heterogeneous Systems Summit, September 1, 2021 (virtual event)
“Solving High Frequency Materials Characterization Challenges in 5G Electronics,” Urmi Ray (INEMI), webinar sponsored by the International Wireless Industry Consortium (IWIC), June 16, 2021
“5G/High Frequency Materials Test Challenges: Closing the Gaps via E2E Supply Chain Collaborative Innovation,” Urmi Ray (INEMI), NIST Workshop: Securing the 5G Supply Chain through Measurement, Potential Adoption Paths for Measurements in 5G Hardware Security Session, May 19, 2021
“High Frequency Measurements Using Wafer Level Techniques: Measuring Low dK/dFMaterials from 1 GHz to 1 THz,” presented by Nathan Orloff (NIST), INEMI session at ICEP, May 13, 2021 (virtual event).
5G Electronics Challenges: High Frequency Materials Characterization
INEMI Invited Session at the International Conference on Device Packaging
April 14, 2021 (virtual event)
Session Chair: Urmi Ray, INEMI
Presentations and speakers:
“Challenges for High Dk/Df Measurements,” Urmi Ray (INEMI)
“Benchmarking Resonator based Low Dk/Df Material Measurements,” Richard Stephenson (EMD Electronics)
“Recent Developments of Resonator Measurements for Emerging Materials and Technologies,” Magorzata Celuch & Marzena Olszewska-Placha (QWED)
“High Frequency Measurements Using Wafer Level Techniques,” Nathan Orloff (NIST)
“Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements,” Say Phommakesone and Daisuke Kato (Keysight Technologies)
INEMI Technical Session: 5G/High Frequency Materials Characterization Challenges and Opportunities
IPC APEX EXPO / March 12, 2021
Moderator: Urmi Ray (INEMI)
"High Frequency Measurements Using Wafer Level Techniques," Nathan Orloff (NIST)
"Benchmarking Resonator Based Low Dk/Df Material Measurements," Michael Hill (Intel) and Malgorzata Celuch (QWED)
"Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements," Say Phommakesone and Daisuke Kato (Keysight)
Project call-for-participation webinar presentation (June 4 & 5, 2020)
Panel Session: Packaging Challenges & Opportunities for 5G Applications
Electronics Packaging Technology Conference (EPTC)
December 4, 2019; Singapore
Moderator: Dr. Haley Fu, INEMI
INEMI co-organized a session at EPTC that featured a diverse panel of speakers who outlined the key drivers and applications for 5G such as high-speed computing, smart phones, automotive, networking, IoT, etc. Discussions from session contributed to the development of INEMI’s initiative on 5G mmWave material characterization and testing.
“Introduction,” Haley Fu (INEMI)
“Antenna-in-Package (AiP) Technology for mmWave 5G Phased Array Chips,” Y.P. Zhang, FIEEE (Nanyang Technological University)
Shunichi Kikuchi (Fujitsu Advanced Technologies Limited)
“5G Related Activity of Hitachi Chemical,” Toshihisa Nonaka, PhD (Packaging Solution Center Hitachi Chemical Co., Ltd.)
“PCB Design and Fabrication Trends – Telecom, Networking & Computing,” Erkko Helminen (TTM Technologies)
Contact
Urmi Ray
[email protected]